SEMICONDUCTOR

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About DRIX

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Drix Semiconductor is a division of DRIX NV, an electronics supplier founded in 1989.

Our waferfab has 360 square meter class 100 cleanroom area with class 10 performance over the wafer processing tools. The fab, small in size when compared to other facilities, has been built specially for low volume production of 100mm wafers.

The production environment has the following features :

-Class 10 levels in wafer processing area's.

-G-line stepper based lithography.

-In-house mask shop.

-Ion implantation based P and B doping 25-200keV.

-Dry and wet processing capabilities.

-PVDF and PFA DI water distribution system.

-Modern gas distribution system.

Fab specifications

• Wafer size = 100mm
• Fab capacity = 3k wafers/month. (bipolar product) / 2k wafers/month (MOS product)
• Cleanroom = 360m², class 10 for wafer processing, class 100 in the alleys.
• Process capability = CMOS, NMOS, Power bipolar, Power MOS.
• Isolation scheme = Local oxidation.
• Process resolution = 2.5µm on low cost masks, 1.25µm on production chrome masks.